Corporate Profile > Management

Strategic Partners  

Craig Geier
Chairman & CEO

Craig has been working in the finance and capital markets for over 25 years with experience in both domestic and international markets, gained in a diverse range of industries and corporate environments from early stage start-ups to major publicly traded entities, including Microbonds Inc. (microelectronics, operating in Asia, Europe and North America) Sulliden Exploration Inc. (gold & silver mining in Peru), TrizecHahn Corporation Limited (Commercial Real Estate in North America), and BCE Development Corporation Ltd. (Commercial Real Estate in North America).

Craig currently sits on the board of directors for Microbonds Inc, Timbercreek Mortgage Investment Corporation, Digital Display & Communication Inc. and DPM Theraputics Corporation (proposed candidate).

Craig attended the University of Western Ontario and completed the Honours Business Administration program at the Ivey Business School in 1981.


Suresh Tanna
Chief Operating Officer

Suresh Tanna brings 30 years of experience in the high technology arena as an engineer and successful entrepreneur. Prior to moving to Canada in 1986, Mr. Tanna worked as a software and hardware design engineer. He owned and operated a business providing system solutions to the education industry. Mr. Tanna joined IBM and worked for five years as a process engineer implementing various processes to improve yield, quality and productivity. Mr. Tanna has owned and operated his own business providing manufacturing solutions to the electronics industry for the past 15 years. He has extensive knowledge of implementing new products and technologies and bringing them to commercialization with prudent time and budget management. He understands both sides of business as a customer and as a supplier. Mr. Tanna has been associated with Microbonds for the last 8 years working in various capacities: from assisting with technology development to improving operational efficiency and fiscal management.

Mr. Tanna holds Bachelor Degree in Electrical Engineering.


William (Bud) Crockett
VP, Global Business Development

Bud received a B.S. degree in Industrial Engineering from Cal Poly State University in San Luis Obispo, California. Prior to receiving his degree, he proudly served in the US Navy for 8 years as weapons control radar systems technician. Before joining Microbonds in the summer of 2005, he worked for 6 years at STATSChipPAC where he had extensive experience in Product Engineering, Technical Program Management and factory Operations. Bud also worked 3 years as an applications engineer for a global semiconductor equipment manufacturer. He was responsible for installing and qualifying equipment. throughout Asia. Bud is involved in all customer technology developments and qualifications at Microbonds. He is currently focused on industry alliance relationships to support the broad commercial adoption of Microbonds technology to the marketplace.




Domenic Romeo
VP, Operations

Domenic holds an Honours B.A.Sc. in Mechanical Engineering from the University of Toronto, and is licensed with Professional Engineers Ontario.

Domenic was previously with Celestica's Power Division in Toronto, where he was an Advisory Engineer responsible for new process equipment development and qualification, manufacturing process flows for new products, and providing process engineering and mechanical failure analysis support for international product and technology transfers. While at Celestica, Domenic also held the roles Staff Engineer and Sr. Associate Team Leader in the Power Division.




Robert Lyn
Founder & CTO

Robert holds a BA Sc degree in Mechanical Engineering from the University of Toronto, and has over 20 years of experience in the microelectronics industry working with Microbonds, IBM Microelectronics and Celestica Inc.

Prior to co-founding Microbonds Inc., Robert was a senior staff engineer in the advanced packaging development division of IBM and subsequently Celestica where he led a team that introduced a number of strategic microelectronics packaging technologies into the manufacturing process, including Chip-on-Board wire bonding technology, Flip Chip technology, Ball Grid Array chip carriers, Multi-chip modules, and single chip packaging. These technologies have supported product offerings, such as; PCMCIA Notebook cards, SIMM memory cards, RF/Wireless cards, Networking cards, Power Technology, PC motherboards, Workstations, Mainframe computers and Internet routing systems.




John Persic
Founder & VP, Research & Development

John holds a a BA Sc degree in Material Science from the University of Toronto, as well as a MASc degree in Applied Science from the University of Toronto, specializing in the area of Metallurgy and Material Science.

John has nearly 10 years of experience in the microelectronics industry. At Celestica, he served as a staff engineer in the process engineering and development division working on process improvements, new product development, and troubleshooting. As a project leader he was responsible for numerous microelectronics packaging and assembly projects, such as wirebonding improvements, encapsulation, contamination control, lead-free solder, conductive adhesives, flip chip/chip scale package development, fluxless soldering, wave-soldering, SMT improvements, chip carrier design, and microvia qualification and testing. John has served as the ISO 9000 Quality representative for Process Engineering and performed ISO and SCC audits, resolved non-conformances and facilitated ISO 9000 training courses.