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  Canadian Nano-player competes with global leaders in semi materials market
Jan 27, 2010
 
 

By Robert Lyn, chief technolgy officer, Microbonds Inc. Relatively unknown in Canada, Markham ON-based Microbonds Inc. has made a name for itself and its technology outside of Canada, within the fiercely competitive market of microelectronics chip assembly. While many people are familiar with silicon chips and transistors made famous by companies like Intel and IBM, what is not commonly understood is how the information inside those chips makes its way to the end-user.

 
 
  33 kB
 
     
  UTAC Selects X-Wire Technology for Volume Production
May 15, 2009
 
 
  27 kB
 
  NxGEN Electronics Selects and Qualifies X-Wire™ Technology for Use in Microelectronic Manufacturing Services
Apr 22, 2009
 
 
  26 kB
 
  Linear Technology and Microbonds Announce Qualification Of X-Wire™ Technology
July 18, 2008
 
 

MILPITAS, Calif. & TORONTO--(Business Wire)--
Linear Technology Corporation (NASDAQ:LLTC) and Microbonds Inc. (a
private Canadian corporation) have announced successful qualification
of Microbonds X-Wire(TM) insulated wire bonding technology to enable
design flexibility for Linear Technology's advanced IC packages.

 
 
  18 kB
 
     
     
 
Archived Press Releases      
2007 Link File Size
Microbonds and PROMEX Industries Announce Major Packaging Technology Alliance, Jul 16, 2007 311 kB
Microbonds, Mirror Semiconductor and PROMEX Industries Announce Major Packaging Technology Alliance, Jun 26, 2007 729 kB
Mirror Semiconductor and Microbonds Announce Alliance on Mirrored Pinout Integrated Circuits and X-Wire™ Technology; Mar 7, 2007 25 kB
2006 Link File Size
Nitto Denko Corporation and Microbonds Announce Technical Alliance on Molding Compounds & Insulated Bonding Wires; Jul 6, 2006 16 kB
Microbonds Announce Release of X-Wire™ Head Start Kit; Jul 5, 2006 15 kB
Cookson Electronics and Microbonds Announce Technical Alliance on Plaskon® and X-Wire™ Technology; Jul 5, 2006 25 kB
March Plasma Systems and Microbonds Announce Technical Alliance on Advanced Bonding Tools & X-Wire™ Technology; Jun 29, 2006 234 kB
SPT (Small Precision Tools) and Microbonds Announce Technical Alliance on Advanced Bonding Tools & X-Wire™ Technology; Jun 28, 2006 29 kB
2005 Link File Size
Kulicke & Soffa and Microbonds Form Joint Alliance on X-Wire™ Technology; Jul 15, 2005 76 kB
New Microchip Connection Technology Raises $7 Million of Funding; Jul 11, 2005 27 kB
Microbonds Expands Management Team, Jul 11, 2005 25 kB
ASM and Microbonds Announce Strategic Alliance for X-Wire™ Technology for Package-Level Interconnect; Jul 11, 2005 35 kB
       
Media Coverage Link File Size
2007      
Chip Scale Review The Tuesday Report; Ron Iscoff, Editor, Chip Scale Review, Aug 7, 2007 182 kB
Package Development Blends Emerging Technologies; Advanced Packaging, Aug 1, 2007  
Microbonds, Mirror Semiconductor and PROMEX Industries Announce Major Packaging Technology Alliance; PCB007, Aug 1, 2007  
Analysis Between Wire Bonding and Flip Chip Interconnect Technology; E. Jan Vardaman, President Tech Search International, Inc., Jul 24, 2007 2.7 Mb
ASM 2007 Semicon West-Technology Seminar; Space The Final Frontier, ASM International, Jul 18, 2007  
A New Interconnect Technology in Blooms; Chip Scale Review, Feature Article by Ron Iscoff, Editor, Mar 6, 2007 327 kB
X-Wire™ Provides a Golden Solution; World Gold Council, Utilize Gold, Feb 21, 2007  
2006 Link File Size
Joe Fjelstad Interview; PCB007, Jul 11, 2006  
Insulated Wire Technology Hits Mainstream; Advanced Packaging, Jul 5, 2006  
The Week in Packaging; Advanced Packaging, News Analysis by Jeffrey C. Demmin, Advanced Packaging Contributing Editor, Jul, 2006  
Semicon West 2006 TechXPOT Offers Special Focus On Test Assembly and Packaging Technologies; SEMI May 4, 2006  
Insulated Bonding Wire Taking Hold; Semiconductor International by John Baliga, Contributing Editor, May 1, 2006  
The Week in Packaging; Advanced Packaging, News Analysis by Jeffrey C. Demmin, Advanced Packaging Contributing Editor, Mar, 2006  
Electronic Interconnections No.9 - Wire Bonding - Still First Choice for Integrated Circuit Die Interconnection; PCB007, Joe Fjelstad, Friday, Mar 31, 2006  
Dispensing, Encapsulating and Underfilling: Picking the 'Right' Equipment for the Job; Chip Scale Review, Feature Article by Terrence Thompson, Senior Editor Jan - Feb, 2006  
2005 Link File Size
Microbonds – Emerging Venture; pg 16, InsideChips.Ventures, Aug 2005  
The Week in Packaging; Advanced Packaging Magazine, News Analysis by Jeffrey C. Demmin, Contributing Editor, Aug 8, 2005  
K&S, Microbonds Form Bonder Alliance; EE Times, Jul 26, 2005  
K&S to Work with Microbonds on Wire Bonding With Insulated Wires; The Semiconductor Reporter, Jul 22, 2005  
K&S, Microbonds Embark on X-Wire™ R&D; Electronic News, Jul 22, 2005  
Microbonds Connection Technology Attracts $7 Million in Funding; The Semiconductor Reporter, Jul 20, 2005  
Coated Wire Bonding Company Raises Funds; EE Times, by Peter Clarke, Jul 20, 2005  
The Week in Packaging; Advanced Packaging Magazine, News Analysis by Jeffrey C. Demmin, Contributing Editor, Jul 11, 2005  
ASMI in Alliance to Develop Insulated Wire Bonding Process; The Semiconductor Reporter, Jul 7, 2005  
ASM, Microbonds to Devise “X-Wire™” Packages; EE Times, Jul 07, 2005  
ASM, Microbonds Ink X-Wire™ Alliance; Electronic News, July 7, 2005  
 
     
   

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