X-Wire™ Technology > Applications

   
  X-Wire™ Applications  
     
 

X-Wire Technology Applications are:

 
   

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Array & Multi-Row QFN
Low I/O Lead Frame
Wire Diameter Reduction (Gold)
Wire Sweep Yield Improvement
Die Shrink
Substrate Simplification
Power Applications
RF / Coaxial Wire Bonding Applications
Stacked Die
Flip-Chip to Wire Bond Conversion
Rapid Prototyping
Engineering Changes

Area Array

Direct-To-Ball Connection
Long Wire Chip-to-Chip MCM
TSOT Lead Frame
Engineering Change
 
 

 

 
   

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