X-Wire™ Technology > What is X-Wire ?

   
  What is X-Wire™ ?  
     
 

X-Wire Technology is a proprietary highly engineered nano-scale thin film dielectric coating developed by Microbonds Inc. When applied to conventional bare bonding wire using a proprietary application process, this coating provides a level of electrical insulation that allows bonding wires to cross and touch within electronic devices without the risk of short-circuiting. This key technology will enable the development of the next generation of smaller, faster, cheaper, and more reliable microchips.

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Microbonds Inc.’s proprietary chemistry invention is a key to this breakthrough that is poised to sustain and extend an existing US$20 B+ wire bond infrastructure and US $4B+ consumables marketplace.

Current X-Wire product versions are available in 18, 20, 23 & 25 micron diameter gold (Au) base wire and copper (Cu) base wire. See the Product page for more details.

 
 

 

 
   

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