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Microbonds Inc. is a pioneer and leader in the research, development and application of insulated bonding wire technology for the semiconductor packaging and microchip industries. The company's X-Wire™ Technology enables the development of faster, smaller and cheaper microchips while improving manufacturing reliability.
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 Canadian Nano-player competes with global leaders in semi materials market, Jan 27, 2010
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UTAC Selects X-Wire™ Technology for Volume Production, May 15, 2009
[PDF, 27 kB]
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NxGEN Electronics Selects and Qualifies X-Wire™ Technology for Use in Microelectronic Manufacturing Services, Apr 22, 2009 [PDF, 26 kB]
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Linear Technology and Microbonds Announce Qualification Of X-Wire™ Technology, Jul 18, 2008 [PDF, 18 kB]
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