NEWS

University of Waterloo, Celestica, Engage Biometrics and Juniper joins Microbonds in ReMAP M4 Project to develop silver-infused nanomaterials for eletrically conductive adhesives
January 9, 2018
    The advancement of nanomaterials has created an opportunity to expand electronics     beyond traditional solders to bendable, flexible adhesives. Together with the University of     Waterloo, Microbonds, Celestica, Engage Biometrics, and Juniper are developing     nanomaterials for electrically conductive adhesives (EDAs). Read More

Microbonds Inc. along with members of ReMAP Project M4 awarded with $5,000 Prize
June 26, 2017
    ReMAP is pleased to announce that the winner of the 2017 Commercialization Prize was     awarded to ReMAP O11 at its AGM in Toronto on June 20th. Read More

Jenex selects Microbonds Inc.'s Silver Solution for next generation thermal therapy insect device in the US
October 18, 2016
    By THE JENEX CORPORATION (TSXV:JEN) ("Jenex" or the "Corporation"), Rob Fia, CEO and     Chairman of Jenex, reports the Corporation has entered into an exclusive product     development agreement with Microbonds Inc. of Markham, Ontario to design Jenex's     next generation thermal therapy insect device. Read More

University of Waterloo partners with Microbonds Inc. on supercapacitors

March 4, 2016 

    The Chemical Engineering department’s newest Associate Professor, Aiping Yu, has been     awarded a Natural Sciences and Engineering Research Council of Canada (NSERC)     Strategic Partnership Grant for her research into advanced "Graphene fiber based     supercapacitors". Read More

Micrbonds Inc. and Grafoid Inc. receive $450,000 for research in wearable supercapacitors
March 1, 2016    
    Six engineering researchers are receiving more than $3.3 million to partner with     Canadian-based companies and government organizations on strategic research     projects. The funding for Strategic Partnership Grants announced March 1 by the Natural     Sciences and Engineering Research Council of Canada (NSERC) brings expertise from     academia and industry together to collaborate on research that will lead to innovation     and commercialization. Read More

Microbonds, University of Waterloo and Celestica selected to support eletronics innovations development in Canada with the First ReMAP Project

February 2, 2015

    Kauai, Hawaii, February 2, 2014 – ReMAP is pleased to announce the network’s first     research project presented at the SMTA Pam-Pacific Symposium earlier this month in     Kauai, Hawaii. Read More

Microbonds Inc. partners with Aumann GmbH to develop new tech for coating metals

December 10, 2014

    Aumann GmbH (Germany) in collaboration with Microbonds (Canada) has developed a     new technology for coating silver, nickel, palladium and other metals on a wire of copper,     copper alloys or steel. The technological solution is an environmentally friendly     alternative to the traditional galvanization process. Read More

Winding Automation Inc. partners with Microbonds Inc.'s ThermoPlating™ Technology

September, 2014

    ThermoPlating (a Trademark of Microbonds) is a revolutionary New Technology for    
    Surface Metallization that is "Cleaner and Leaner". The coating material by Microbonds is     applied and cured using a specially designed system. It is a low cost of ownership process     that aligns well with corporate GREEN Initiatives. Read More

University of Waterloo partners with Microbonds Inc. on research in nanomaterials synthesis and characterization

February 27, 2014

    This student will work on the synthesis and characterization of various nanomaterials,     such as metallic and oxide nanowires, special for the application on microelectronic     packaging, solar photovoltaic devices and innovative nanowire membrane technology     for water treatment. Read More

University of Waterloo supports Microbonds Inc. in research on Palladium Nanoparticles Loaded on Carbon Modified TiO2 Nanobelts for Enhanced Methanol Electrooxidation

September 12, 2013

    By uWaterloo; Direct methanol fuel cells (DMFC) have garnered interest in the portable     devices and transportation industries because of their relatively low cost, high storage     capabilities, low temperature operation, low-carbon  emission, and high energy density.     Read More

University of Waterloo partners with Microbonds Inc. to lower production costs in its semiconductor packaging business
March 25, 2011                
    By The Globe and Mail; Innovation.Every business values  the chance to get  a jump on     the competition by giving its products an edge in the marketplace. Hooking up with     higher education experts, many of whom are at the vanguard of their chosen     specialties, is becoming an even more important way to do that. Read More

University of Waterloo partners with Microbonds Inc. on NSERC Project: Novel Conductive Adhesives as a Lead-free and Multifunctional Joining Alternative for Electronic Packaging

January 21, 2011

    Researchers at the University of Waterloo will get a cash infusion of nearly $2.6 million to     support their work, including two projects in nanotechnology. Read More

Microbonds Inc. along with partners University of Waterloo, Celestica and Research in Motion Ltd. receives grant for NSERC Project: Novel Conductive Adhesives as a Lead-free and Multifunctional Joining Alternative for Electronic Packaging

January, 2011    

    NSERC awarded $54.9 million over three years to 122 applications in the 2010 Strategic     Project Grants and New Media Initiative competition. The competition attracted a record     number of applications (547 in total), dropping the success rate to 22 percent. Read More

Canadian Nano-player competes with global leaders in semi materials market

January 27, 2010

    By Robert Lyn, chief technolgy officer, Microbonds Inc. Relatively unknown in Canada,     Markham ON-based Microbonds Inc. has made a name for itself and its technology     outside of Canada, within the fiercely competitive market of microelectronics chip     assembly. While many people are familiar with silicon chips and transistors made     famous by companies like Intel and IBM, what is not commonly understood is how the     information inside those chips makes its way to the end-user. Read More 

UTAC Selects X-Wire™ Technology for Volume Production

May 15, 2009

NxGEN Electronics Selects and Qualifies X-Wire™ Technology for Use in Microelectronic Manufacturing Services

April 22, 2009

Linear Technology and Microbonds Announce Qualification Of X-Wire™ Technology

July 18, 2008

    MILPITAS, Calif. & TORONTO--(Business Wire)--

    Linear Technology Corporation (NASDAQ:LLTC) and Microbonds Inc. (a

    private Canadian corporation) have announced successful qualification

    of Microbonds X-Wire(TM) insulated wire bonding technology to enable

    design flexibility for Linear Technology's advanced IC packages. Read More