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X-Wire™
Technology has cost and
performance benefits to
microchip & package designers
and manufacturers:
Enables the use of finer
diameter gold and copper bonding wires
facilitating smaller microchip
packages and reduced gold costs.
Improved manufacturing yields
and reliability by preventing
electrical shorting.
Allows bonding wires to cross or
touch without shorting, greatly
increasing microchip and package
design and layout flexibility.
Allows for use of simplified
wire bond looping profiles and
longer wires.
Increased interconnect density
and bandwidth enabling greater
overall performance including
functionality.
Die shrink, which both reduces
the size of the microchip
package and lowers microchip
costs.
Direct chip-to-chip connection
capability, increasing
performance and reducing
substrate costs.
Simplified substrates permit
material cost reductions.
No upfront capital costs,
reduced qualification costs for
end customers. |
