|
|
Link |
File |
Size |
 'Microelectronic Wire
Bonding with Insulated Au Wire-
Effects of Process Parameters on
Insulation Removal and Crescent
Bonding' by Jaesik
Lee, Michael Mayer,
Norman Zhou, John Persic;
Materials Transactions,
Vol. 49, No. 10 (2008)
pp. 2347 to 2353, 2008
The Japan Institute of
Metals |
 |
 |
474 kB |
|
'Robust Wirebonding of X-Wire™
Insulated Bonding Wire
Technology'
by Christopher Carr,
Juan Munar, William Crockett,
Robert Lyn, Microbonds Inc.
Presented at
IMAPS 2007, San
Jose, CA. |
|
|
167 kB |
|
'Pull
Force and Tail Breaking
Force Optimization of
the Crescent Bonding
Process with Insulated
Au Wire'
by J. Lee,
M. Mayer & Y. Zhou, University
of Waterloo, J. Persic,
Microbonds Inc. Presented at
EPTC 2007, Singapore. |
|
|
812 kB |
|
''Assembly
Using X-Wire™ Insulated
Bonding Wire Technology'
by Robert Lyn and
William (Bud) Crockett;
MEPTEC Report / Q3 2007,
Bonding Wire Technology. |
|
|
398 kB |
|
'Analysis between Wire Bonding
and flip Chip Interconnect
Technology'
by E. Jan Vardaman,
President,
Tech Search
International, Inc. |
|
|
2.7 Mb |
|
SPT/Microbonds :: Application
Note -
'Stitch Bond Enhancement
for X-Wire™ with Stitch
Integrator (SI)
Capillary™'. |
|
|
133 kB |
|
March Plasma Systems/Microbonds
:: Application Note -
'Plasma
Treatment of X-Wire™'. |
|
|
106 kB |
|
'Assembly Using X-Wire™ Insulated
Bonding Wire Technology'
(Conference Paper: Semicon
Singapore 2007) by Robert Lyn,
William Crockett. |
|
|
403 kB |
|
'X-Wire™
- Insulated Wire Bonding
Technology',
ASM/SPT Data Sheet. |
|
|
115 kB |
|
'X-Wire™
- Wire Bonding
Interconnection
Technology',
ASM Wire Bonding Brief/ ASM 製品 概要. |
|
|
300 kB |
|
'X-Wire™ Technology
Insulated Bonding Wire', Product Sheet. |
|
|
382 kB |
|
'X-Wire™ White Paper'. |
|
|
14 kB |
|
'Microbonds
X-Wire™ Technology Overview',
May 2006. |
|
|
1.4 Mb |
|
'Overview of X-Wire™? Insulated
Bonding Wire Technology'
(Conference Paper: IMAPS 2006)
by Robert Lyn, John
Persic, Young-Kyu Song. |
|
|
581 kB |
