microbonds
X-Wire™ Technology > Design Features
X-Wire™ Technology Design Features and Properties
Breakdown Voltage [ ~ 50V for typical 0.8mil insulated bonding wire] [ custom voltages > 100V are available upon request]
Insulation Thickness [ ~75nm for 50V coating thickness]
Dielectric Constant [view document; PDF 57 kB]
Design and Layout Rules [view document; PDF 403 kB]
X-Wire™ Coating Features and Benefits
Excellent Adhesion to Au Solvent Resistance Flexural Strength Thermal Stability Environmentally Friendly
No Cracking, Flaking, Peeling Chemically resistant to IPA Good Bondability No Melting, Tested >300 °C Organic Material, RoHS
© MICROBONDS INC.
X-Wire™ Coating Thickness Relative to Wire Diameter [25 μm]
HOME | NEWS | TERMS OF USE | CONTACT
COPYRIGHT © 2009 MICROBONDS INC. ALL RIGHTS RESERVED.