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X-Wire™
Technology is a proprietary
highly engineered nano-scale
thin film dielectric coating
developed by Microbonds Inc.
When applied to conventional
bare bonding wire using a
proprietary application process,
this coating provides a level of
electrical insulation that
allows bonding wires to cross
and touch within electronic
devices without the risk of
short-circuiting. This key
technology will enable the
development of the next
generation of smaller, faster,
cheaper, and more reliable
microchips.
Microbonds Inc.'s proprietary
chemistry invention is a key to
this breakthrough that is poised
to sustain and extend an
existing US$20 B+ wire bond
infrastructure and US $4B+
consumables marketplace.
Current X-Wire™
product versions are available
in 18, 20, 23 & 25 micron
diameter gold (Au) base wire and
copper (Cu) base wire. See the
Product
page for more details. |
